SCHNEIDER ELECTRIC INDUSTRIES SAS : VIE - FIRMWARE EMBEDDED ENGINEER - ANDOVER USA (F/H)

Poste
Volontariat International en Entreprise (V.I.E) (18 mois)
Niveau d'étude
Bac+5 (Master / Ingénieur)
Métier
Systèmes d'informations - Télécom : Matériel
Localisation
Andover -Ma-, Etats-Unis

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Missions

Where is the VIE Position

In our US SE offices. The office is in Andover, an R&D office (open spaces + Labs) with around 600 people. All Schneider’s businesses are represented. The R&D Innovation & Technology (I&T) team is composed of ~ 25 engineers. We have Hardware experts, Software and Firmware developers, Architects and Testers. The I&T group is divided into 3 teams: Communication, Edge, and Cybersecurity. The Communication team focuses on Embedded System Research on secure and deterministic Ethernet communication. The Edge team focuses on Edge Platforms and Cloud Services, and the Cybersecurity team focuses primarily on Embedded Cybersecurity.

What is the Position?

Schneider Electric is divided into different Business Units (BU) . One of them is called “Industrial Automation”. This business contains specific Lines of Businesses that create solutions for a particular segment. For example, Digital Factory or Process Automation. Within this BU, our department is called: Innovation and Technology (I&T) . In I&T our goal is to be the right arm of the CTO. We are researching tomorrow’s technologies, experimenting, prototyping, and helping the Line of Business integrate all the new technologies into their product.

As part of the Industrial Communication team in I&T (Innovation and Technology) , you will be involved in two main activities: Research and Development. The research consists in evaluating technology, understanding how it works, creating a Prototype or a PoC, producing a whitepaper and sharing the knowledge across the Industrial automation B.U. Once the research is completed, we can work on developing a component around this technology.

Which missions will you lead?
  • Develop prototypes to test new features of OPC UA protocol
  • Research and investigate new communication protocols
  • Test software components on new platform (different OS and hardware)
  • Build Proof of Concept to test TSN standards (Time Sensitive Networking)

Profil recherché

What are the qualifications we are looking for?

Education:

Master’s degree in Engineering
Engineering background
Fluent in English
C language, Ethernet networking, Embedded Systems, Linux, Compilation and Cross-Compilation, Git, Real Time OS

Work experience:

1 years’ experience in firmware embedded engineering (apprenticeship or internship)

Skills:

Passion for exploring new ideas
Love to solve problems

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